Why Board Cleaning Matters
Printed circuit boards are core components of electronic products. During manufacturing contaminants such as flux residues and dust adhere to board surfaces. If not removed these contaminants reduce performance and reliability causing product failure.
Spray Cleaning Method
Equipment uses high pressure pumps to direct cleaning fluid at set angles onto board surfaces. High pressure liquid impacts contaminants causing detachment. Spray angle and pressure are adjustable per board type.
Brush Cleaning Method
Some cleaners use soft brushes driven by motor rotation removing stubborn contaminants through friction. Force is controllable via motor speed to avoid surface damage.
Ultrasonic Wave Cleaning
This method uses cavitation effect from ultrasonic waves in liquid. Tiny bubbles form then collapse generating forces dislodging contaminants from surfaces and gaps effectively.
Chemical Reaction Cleaning
Cleaning fluids contain agents reacting with surface contaminants. Chemicals dissolve organic matter into soluble compounds while emulsifiers disperse oils preventing re-deposition.
Preparation Steps
Inspect equipment before each use checking nozzles generator brushes and fluid level. Sort boards confirming no damage and place in baskets ensuring stable positioning.
Configuration
Select chemistry matching contaminant type. Temperature range 40 to 60 degrees works well. Adjust pressure per board type and set time accordingly.
Operation Sequence
Start circulation system first then activate devices per settings. Monitor closely stopping for issues. After completion rinse with pure water and dry completely using oven or hot air until moisture free.
